Meister Abrasives diamond grinding tools are used for the fine grinding of wafers and for wafer dicing. With excellent TTV values, surface qualities in the one digit Angstrom range are achieved. Hybrid and ceramic bonded grinding tools represent a quantum leap in quality and reliability in semiconductor processing.
The specially developed grinding tools from Meister are used for processing materials such as Si, SiC, sapphire, GaN, InP, GaAS, LiNb, LiTa and extreme hard ceramics. The following production processes are supported by grinding wheels from Meister:
- Ingot and Boule shaping
- Edge and Notch grinding on wafer
- General Wafer thinning, Back grinding and wafer reclaim
- Dicing of wafers and ceramic substrates