High-tech processes in the manufacture of semiconductor components require high-tech grinding wheels.
Meister Abrasives’ micro grit product range used for fine grinding of prime wafers or back thinning applications are capable of achieving surface finishes in the angstrom range. Ceramet hybrid and vitrified bonded grinding wheels create a quantum leap in photovoltaic grinding process efficiency.
Prime wafer manufacturing
Grinding applications in the manufacturing chain for wafer-substrate such as Si, SiC, Saphir, GaN, InP, GaAS, LnNb, LnTa and others
Advanced wafer thinning applications
All kind of wafer thinning applications like for MEMS, SOI, 3D-TSV, ultra thin wafers, eWlp, Taiko grinding, dicing before grinding (DBG) etc...
LED manufacturing based on Sapphire / SiC
Grinding application in the value chain of LED manufacturings and GaN based power devices
Photovoltaic solar wafer manufacturing
Ingot / Brick grinding applications before wire sawing processings